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  • Technical Developments

R & D

Technical Developments

MPT(Micro Pattern Treatment) Technology

MPT.pdf Download

Dual Side QFN : Requested by Infineon, German / TI, USA, Applied to Smart Phone

SPM (Smart Power Mobile) : Under Development for Nex-Gen EV from HMC

Flip Chip Bonding and Clip Bonding

DSC Package : Under Development - Semiconductor for EV

D/A and Wire Bonding

Attaching of Top/Bottom Substrate

Mold and Singulation

LTCC Package : Under Development (SiC + Al Soldering : 8x8x1.27mm)

TO-252 : Under Development (Cu Sintering, Al Soldering)

Al Pad Metal + Al Soldering + Cu Clip

48V MHSG Case Module (for H Company, EV Car)

6.5KV Case Module (for U Company, SiC Device)

DSC PKC Development using Ultrasonic Welding